Product Name
PH-Series
Description
Probe card that enables advances in integrated, wafer testing. Provides high test parallelism with the ability to test greater than 256 die simultaneously. This ability allows the test of a single 300 mm wafer in as few as six touchdowns.
Features include:
* 3D MEMS MicroSpring contact design with high pin count and small pad size capability
* Wide temperature compatibility for controlled probing and setup, higher probe card availability and better test throughput
* Scalability to 50um pad pitch
* Improved planarization control for planarity
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