Product Name
QiLin
Description
Probe card that provides a test solution for advanced Wafer Level Chip-scale Packaged (WLCSP) devices. Optimized for alignment and planarity, The multi-DUT product, optimized for alignment and planarity, delivers performance with reliability in production regimes. Central to the prober is a spring design that uses crown-tipped spring pins as the contact element, which delivers the necessary mechanical compliance for solder bump probing in a way that minimizes bump damage.
Company Associations
Glossary Associations
Taxonomy Associations
|
|
